LB200

Automatic Lens Bonder

The LB200 is a fully automatic lens bonding machine for 10/25G optical modules and HDMI optoelectronic modules lens assembly application. It is equipped with patented up/down looking optics for high accurate alignment, fast and reliable bond head system, highly speed linear motor bond stage, and UV glue writer and in-situ UV curing system for precise lens bonding.

HPDB100S

High-Precision Epoxy Die Bonder

The HPDB100S is a fully automatic epoxy die bonding machine for 100G/400G optical modules and LIDAR application. It is highly flexible in handling a wide range of die size and substrates size. Package conversion can be carried out quickly and easily. The HPDB100S is equipped with fast and reliable bond head system, highly accurate linear motor bond stage, high speed PRS with pre-bond / 2nd alignment /post-bond inspection systems and epoxy writer system for precise die bonding.