1. Fully Automated Multi-Cassette Handler: Supports 4" to 6" wafers with automatic loading/unloading and intelligent result-based binning (sorting).
2. High-Precision Platform: Features a precision optical system and a vibration-isolated motion platform (VC-C), ensuring a measurement accuracy of 1 µm.
3. Flexible Configuration: Allows users to define custom measurement areas, positions, and binning rules to meet specific process requirements.
4. AI-Powered Edge Detection: Utilizes a deep learning-based intelligent capture algorithm for precise extraction of object dimension boundaries.
5. Robust & Versatile Measurement: Adapts to various material types, effectively suppresses reflective interference, and utilizes high-resolution acquisition for accurate height and dimensional measurement.
SPC & Traceability: Integrated Statistical Process Control (SPC) function monitors the production process in real-time, enabling data-driven management and full traceability of results.