1. Fully Automated Multi-Cassette Handling：Supports 4" to 6" wafers with automatic loading/unloading and ink marking.
2. High-Speed Processing：Features high-speed image acquisition and parallel processing, achieving an image processing throughput of > 100 frames/second.
3. Intelligent Defect Detection：Incorporates an attention mechanism to focus on critical regions, capable of detecting minimum defects < 0.5 µm.
4. Dual-Side Inspection：Supports backside inspection; automatically completes double-sided detection with results merged into a single report.
5. Consistent AI Recognition：Utilizes AI adaptive segmentation technology to maintain a consistent defect recognition rate across different chip batches.
6. User-Friendly Configuration：Features a visual interface for configuring inspection strategies, adjusting control parameters, and managing the sample library.