High-Speed Parallel Inspection: Simultaneous inspection of P-side, N-side, AR-side, and HR-side, with a cycle time of < 3 seconds per unit.
Sub-Micron AI Detection: Incorporates an attention mechanism with a sub-micron AI detection model; 1. AR-side inspection accuracy < 0.2 µm.
2. Precision Image Alignment: High-precision image alignment with an error margin of < 0.2 pixels, ensuring data integrity and artifact-free results.
3. Intelligent Sorting & Control: User-defined control parameters and binning rules; defects are quantified and automatically sorted into BINS.
4. SPC & Traceability: Integrated Statistical Process Control (SPC) for real-time production monitoring, enabling data-driven management and full traceability.
5. Self-Optimizing AI Model: AI model features self-adaptive optimization with online incremental training, automatically adapting to complex process variations.