High-Throughput Handling: Supports 8" to 12" wafers with dual loading/unloading stations. Equipped with two robotic arms for alternating operation to maximize efficiency.
Ultra-Fast Auto-Focusing: Features high-speed auto-focusing technology that predicts height variations across different regions of the wafer surface in real-time.
1. High-Speed Imaging & Processing: Configured with a high-speed microscopic optical system for parallel image acquisition and processing. Achieves an image processing throughput of > 100 frames/second.
2. Sub-Micron AI Detection: Incorporates an attention mechanism for sub-micron detection accuracy. 3. Capable of detecting minimum defects < 0.5 µm.
4. Intelligent & Adaptive AI: Features smart defect annotation. A single AI model supports various chip types, utilizing continuous learning and incremental training for adaptability.
5. Full AI Parallel Acceleration: 100% AI-driven inspection powered by a CUDA parallel acceleration engine, enabling parallel analysis and computation of image blocks.