1.Equipped with 2 independent pick&place bondhead, bondhead table is driven by high speed 2. DDR motor, pick and place process in parallel to increase throughout.
2.Bondhead Individually adjustable pick force and bond force control, missing units detection, die angle auto adjustment .
3.Support up to 6-inch wafer frame input and output.
4.Equipped with 3 optics for wafer table PR, die uplook PR and bin table PR inspection.
5.Equipped with Multiple pin ejector system and programmable height of ejector pin.
6.Equipped with wafer barcode reader to auto load wafermap, support wafer scanning and wafermap auto reference.